@inproceedings{25f6e6dcf19e48029aec32d21cffad97,
title = "Rapid prototyping of multilayer thermoplastic microfluidic chip",
abstract = "Thermoplastic is a common material in industrial products and it can be applied to microfluidic application since it is much more affordable and stable than PDMS in vary aspects. Based on former studies, a manufacturing process of thermoplastic microfluidic system is proposed, from the feature design to the final microfluidic device. The protocol being proposed is able to achieve rapid prototyping of multilayer thermoplastic microfluidic chips, improve the study efficiency of functional microfluidic product, shorten the period from laboratory to market as well as provide an alternative option for further developing microfluidic commercial products.",
keywords = "dry film resist, hot-embossing, microfluidic, thermoplastic",
author = "Tianhang Yang and Ye Su and Songjing Li",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 7th International Conference on Fluid Power and Mechatronics, FPM 2015 ; Conference date: 05-08-2015 Through 07-08-2015",
year = "2015",
month = nov,
day = "24",
doi = "10.1109/FPM.2015.7337206",
language = "英语",
series = "Proceedings of 2015 International Conference on Fluid Power and Mechatronics, FPM 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "706--710",
booktitle = "Proceedings of 2015 International Conference on Fluid Power and Mechatronics, FPM 2015",
address = "美国",
}