Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Z. L. Li; H. J. Dong; X. G. Song; H. Y. Zhao; J. C. Feng; J. H. Liu; H. Tian; S. J. Wang

doi:10.1016/j.ultsonch.2016.12.026

Rapid formation of Ni₃Sn₄ joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Z. L. Li
, H. J. Dong
, X. G. Song^*
, H. Y. Zhao
, J. C. Feng
, J. H. Liu
, H. Tian
, S. J. Wang

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology Weihai
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

37 Scopus citations

Abstract

High melting point Ni₃Sn₄ joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8 s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni₃Sn₄ grains with the average diameter of 2 μm, perform the average shear strength of 26.7 MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni₃Sn₄ joints.

Original language	English
Pages (from-to)	111-120
Number of pages	10
Journal	Ultrasonics Sonochemistry
Volume	36
DOIs	https://doi.org/10.1016/j.ultsonch.2016.12.026
State	Published - 1 May 2017

Keywords

EBSD
Grain morphology
NiSn joints
Orientation relationship
TLP bonding
Ultrasonic soldering

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10.1016/j.ultsonch.2016.12.026

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title = "Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process",

abstract = "High melting point Ni3Sn4 joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8 s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni3Sn4 grains with the average diameter of 2 μm, perform the average shear strength of 26.7 MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni3Sn4 joints.",

keywords = "EBSD, Grain morphology, NiSn joints, Orientation relationship, TLP bonding, Ultrasonic soldering",

author = "Li, \{Z. L.\} and Dong, \{H. J.\} and Song, \{X. G.\} and Zhao, \{H. Y.\} and Feng, \{J. C.\} and Liu, \{J. H.\} and H. Tian and Wang, \{S. J.\}",

note = "Publisher Copyright: {\textcopyright} 2016 Elsevier B.V.",

year = "2017",

month = may,

day = "1",

doi = "10.1016/j.ultsonch.2016.12.026",

language = "英语",

volume = "36",

pages = "111--120",

journal = "Ultrasonics Sonochemistry",

issn = "1350-4177",

publisher = "Elsevier B.V.",

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TY - JOUR

T1 - Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

AU - Li, Z. L.

AU - Dong, H. J.

AU - Song, X. G.

AU - Zhao, H. Y.

AU - Feng, J. C.

AU - Liu, J. H.

AU - Tian, H.

AU - Wang, S. J.

PY - 2017/5/1

Y1 - 2017/5/1

N2 - High melting point Ni3Sn4 joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8 s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni3Sn4 grains with the average diameter of 2 μm, perform the average shear strength of 26.7 MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni3Sn4 joints.

AB - High melting point Ni3Sn4 joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8 s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni3Sn4 grains with the average diameter of 2 μm, perform the average shear strength of 26.7 MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni3Sn4 joints.

KW - EBSD

KW - Grain morphology

KW - NiSn joints

KW - Orientation relationship

KW - TLP bonding

KW - Ultrasonic soldering

UR - https://www.scopus.com/pages/publications/85006986632

U2 - 10.1016/j.ultsonch.2016.12.026

DO - 10.1016/j.ultsonch.2016.12.026

M3 - 文章

C2 - 28069229

AN - SCOPUS:85006986632

SN - 1350-4177

VL - 36

SP - 111

EP - 120

JO - Ultrasonics Sonochemistry

JF - Ultrasonics Sonochemistry

ER -

Rapid formation of Ni₃Sn₄ joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Abstract

Keywords

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