Rapid formation of Cu-Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

Bo Hu; Fan Yang; Ye Peng; Hongjun Ji; Shihua Yang; Ming Yang; Mingyu Li

doi:10.1007/s10854-019-01129-y

Rapid formation of Cu-Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

Bo Hu
, Fan Yang
, Ye Peng
, Hongjun Ji^*
, Shihua Yang
, Ming Yang^*
, Mingyu Li

^*Corresponding author for this work

Harbin Institute of Technology Shenzhen
Shanghai Aerospace Equipments Manufacturer
Hisilicon Optoelectronics Co., Ltd

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

A new type of Ag nanoparticle (NP) paste for rapid sintering was prepared by controlling the thickness of the NP capping agent. The Ag NP paste was combined with a rapid thermo-compression (RTC) method to form a reliable Cu-Cu joint. The shear strengths of the Cu/Ag NP/Cu joints were 46.8 MPa and 90.7 MPa after sintering at 300 °C for only 5 s and 20 s, respectively. The sintering sequence phenomenon was observed, and the differences in microstructure between the pressureassisted and pressureless joints were investigated. Robust bonding at the lattice level between the Ag NPs and Cu substrate was observed by high-resolution transmission electron microscopy, and this bonding contributed to the high shear strength obtained under rapid sintering conditions. A commercially acceptable alternative solution to achieving reliable Cu-Cu joint formation was obtained, especially for thermo-sensitive devices.

Original language	English
Pages (from-to)	8071-8079
Number of pages	9
Journal	Journal of Materials Science: Materials in Electronics
Volume	30
Issue number	8
DOIs	https://doi.org/10.1007/s10854-019-01129-y
State	Published - Apr 2019
Externally published	Yes

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title = "Rapid formation of Cu-Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste",

abstract = "A new type of Ag nanoparticle (NP) paste for rapid sintering was prepared by controlling the thickness of the NP capping agent. The Ag NP paste was combined with a rapid thermo-compression (RTC) method to form a reliable Cu-Cu joint. The shear strengths of the Cu/Ag NP/Cu joints were 46.8 MPa and 90.7 MPa after sintering at 300 °C for only 5 s and 20 s, respectively. The sintering sequence phenomenon was observed, and the differences in microstructure between the pressureassisted and pressureless joints were investigated. Robust bonding at the lattice level between the Ag NPs and Cu substrate was observed by high-resolution transmission electron microscopy, and this bonding contributed to the high shear strength obtained under rapid sintering conditions. A commercially acceptable alternative solution to achieving reliable Cu-Cu joint formation was obtained, especially for thermo-sensitive devices.",

author = "Bo Hu and Fan Yang and Ye Peng and Hongjun Ji and Shihua Yang and Ming Yang and Mingyu Li",

note = "Publisher Copyright: {\textcopyright} Springer Science+Business Media, LLC, part of Springer Nature 2019.",

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month = apr,

doi = "10.1007/s10854-019-01129-y",

language = "英语",

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TY - JOUR

T1 - Rapid formation of Cu-Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

AU - Hu, Bo

AU - Yang, Fan

AU - Peng, Ye

AU - Ji, Hongjun

AU - Yang, Shihua

AU - Yang, Ming

AU - Li, Mingyu

PY - 2019/4

Y1 - 2019/4

N2 - A new type of Ag nanoparticle (NP) paste for rapid sintering was prepared by controlling the thickness of the NP capping agent. The Ag NP paste was combined with a rapid thermo-compression (RTC) method to form a reliable Cu-Cu joint. The shear strengths of the Cu/Ag NP/Cu joints were 46.8 MPa and 90.7 MPa after sintering at 300 °C for only 5 s and 20 s, respectively. The sintering sequence phenomenon was observed, and the differences in microstructure between the pressureassisted and pressureless joints were investigated. Robust bonding at the lattice level between the Ag NPs and Cu substrate was observed by high-resolution transmission electron microscopy, and this bonding contributed to the high shear strength obtained under rapid sintering conditions. A commercially acceptable alternative solution to achieving reliable Cu-Cu joint formation was obtained, especially for thermo-sensitive devices.

AB - A new type of Ag nanoparticle (NP) paste for rapid sintering was prepared by controlling the thickness of the NP capping agent. The Ag NP paste was combined with a rapid thermo-compression (RTC) method to form a reliable Cu-Cu joint. The shear strengths of the Cu/Ag NP/Cu joints were 46.8 MPa and 90.7 MPa after sintering at 300 °C for only 5 s and 20 s, respectively. The sintering sequence phenomenon was observed, and the differences in microstructure between the pressureassisted and pressureless joints were investigated. Robust bonding at the lattice level between the Ag NPs and Cu substrate was observed by high-resolution transmission electron microscopy, and this bonding contributed to the high shear strength obtained under rapid sintering conditions. A commercially acceptable alternative solution to achieving reliable Cu-Cu joint formation was obtained, especially for thermo-sensitive devices.

UR - https://www.scopus.com/pages/publications/85064230730

U2 - 10.1007/s10854-019-01129-y

DO - 10.1007/s10854-019-01129-y

M3 - 文章

AN - SCOPUS:85064230730

SN - 0957-4522

VL - 30

SP - 8071

EP - 8079

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - 8

ER -

Rapid formation of Cu-Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste

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