Abstract
Reducing GaN-on-diamond interfacial thermal resistance is crucial to maximize the thermal benefit of diamond substrates for high power transistor applications. In this work, we demonstrate a rapid, contactless transient thermoreflectance technique to assess the interfacial thermal resistance of as-grown GaN-on-diamond wafers.
| Original language | English |
|---|---|
| Pages | 151-153 |
| Number of pages | 3 |
| State | Published - 2015 |
| Externally published | Yes |
| Event | 30th International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2015 - Scottsdale, United States Duration: 18 May 2015 → 21 May 2015 |
Conference
| Conference | 30th International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2015 |
|---|---|
| Country/Territory | United States |
| City | Scottsdale |
| Period | 18/05/15 → 21/05/15 |
Keywords
- GaN-on-diamond
- TBReff
- Transient thermoreflectance
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