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Quasicontinuum simulation of effect of crystal orientation and cutting direction of on nanometric cutting of single crystal copper

  • Hongmin Pen*
  • , Qingshun Bai
  • , Yingchun Liang
  • *Corresponding author for this work
  • School of Mechatronics Engineering, Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Quasicontinuum simulation of nanometric cutting was conducted on single crystal copper to investigate the effect of crystal orientation and cutting direction on nature of deformation of this material. The model reduces the degrees of freedom in simulations of nanometric cutting process without sacrificing important physics. The simulation results show the crystal orientation and cutting direction have a significant effect on the nature of deformation of nanometric cutting process. In addition, the variations of strain energy of workpiece atoms in different crystal set-ups are investigated.

Original languageEnglish
Title of host publicationMachining and Advanced Manufacturing Technology X
PublisherTrans Tech Publications Ltd
Pages154-157
Number of pages4
ISBN (Print)0878492844, 9780878492848
DOIs
StatePublished - 2010
Externally publishedYes
Event10th International Conference on Machining and Advanced Manufacturing Technology - Jinan, China
Duration: 7 Nov 20099 Nov 2009

Publication series

NameKey Engineering Materials
Volume431-432
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

Conference10th International Conference on Machining and Advanced Manufacturing Technology
Country/TerritoryChina
CityJinan
Period7/11/099/11/09

Keywords

  • Crystal orientation
  • Multiscale simulation
  • Nanometric cutting
  • Single crystal copper

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