@inproceedings{8af8d7ebdea14783a5c31df5918718d4,
title = "Quasicontinuum method simulation of nanometric cutting of single crystal copper",
abstract = "A multiscale simulation model was built to study the nanometric cutting process of single crystal copper. This multiscale model distinctly reduces the degree of freedom of the whole system compared with full atomistic simulations. Through analyzing the fluctuations of tangential cutting force and strain energy with cutting distance, we confirm that the deformation mechanism of single crystal copper is plastic deformation caused by generation and evolution dislocation. The highest compressive stress locates in shear zone and highest tensile stress locates in the machined surface and subsurface. Simulation results show that there exists a high value of stress around dislocations, which reveals the local high value of stress is the main reason for the generation and evolution of dislocations in the workpiece material.",
keywords = "Dislocation, Nanometric cutting, Quasicontinuum method, Single crystal copper, Stress",
author = "Liang, \{Y. C.\} and Pen, \{H. M.\} and Bai, \{Q. S.\}",
year = "2009",
doi = "10.4028/www.scientific.net/MSF.628-629.381",
language = "英语",
isbn = "0878493123",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "381--386",
booktitle = "Advances in Materials Manufacturing Science and Technology XIII",
address = "瑞士",
note = "13th International Manufacturing Conference in China, IMCC2009 ; Conference date: 21-09-2009 Through 23-09-2009",
}