Process simulation based on anodic bonding models

Weiping Chen; Dan Zhang; Xiaowei Liu; Rongyan Chuai

Process simulation based on anodic bonding models

Weiping Chen^*
, Dan Zhang
, Xiaowei Liu
, Rongyan Chuai

^*Corresponding author for this work

School of Astronautics

Harbin Institute of Technology
Heilongjiang University
Shenyang University of Technology

Research output: Contribution to journal › Article › peer-review

Abstract

Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.

Original language	English
Pages (from-to)	270-271
Number of pages	2
Journal	Zhongguo Jixie Gongcheng/China Mechanical Engineering
Volume	16
Issue number	SUPPL.
State	Published - Jul 2005

Keywords

Anodic bonding
CAD
Process simulation
Technology database

Cite this

@article{4e6310fb2e15442faa1d43c09d2e5246,

title = "Process simulation based on anodic bonding models",

abstract = "Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.",

keywords = "Anodic bonding, CAD, Process simulation, Technology database",

author = "Weiping Chen and Dan Zhang and Xiaowei Liu and Rongyan Chuai",

year = "2005",

month = jul,

language = "英语",

volume = "16",

pages = "270--271",

journal = "Zhongguo Jixie Gongcheng/China Mechanical Engineering",

issn = "1004-132X",

publisher = "Chinese Mechanical Engineering Society",

number = "SUPPL.",

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TY - JOUR

T1 - Process simulation based on anodic bonding models

AU - Chen, Weiping

AU - Zhang, Dan

AU - Liu, Xiaowei

AU - Chuai, Rongyan

PY - 2005/7

Y1 - 2005/7

N2 - Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.

AB - Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.

KW - Anodic bonding

KW - CAD

KW - Process simulation

KW - Technology database

UR - https://www.scopus.com/pages/publications/23744503972

M3 - 文章

AN - SCOPUS:23744503972

SN - 1004-132X

VL - 16

SP - 270

EP - 271

JO - Zhongguo Jixie Gongcheng/China Mechanical Engineering

JF - Zhongguo Jixie Gongcheng/China Mechanical Engineering

IS - SUPPL.

ER -

Process simulation based on anodic bonding models

Abstract

Keywords

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