Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

Hui Fang; Chenxi Wang; Te Wang; Hong Wang; Shicheng Zhou; Yilong Huang; Yanhong Tian

doi:10.1016/j.matlet.2019.126620

Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

Hui Fang
, Chenxi Wang^*
, Te Wang
, Hong Wang
, Shicheng Zhou
, Yilong Huang
, Yanhong Tian

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology
Academy of Space Electronic Information Technology

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O₂ plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 °C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation.

Original language	English
Article number	126620
Journal	Materials Letters
Volume	256
DOIs	https://doi.org/10.1016/j.matlet.2019.126620
State	Published - 1 Dec 2019

Keywords

Low-temperature bonding
Nanoparticles
Plasma activation
Shear strength
Sintering
Thermal conductivity

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10.1016/j.matlet.2019.126620

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title = "Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging",

abstract = "A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 °C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation.",

keywords = "Low-temperature bonding, Nanoparticles, Plasma activation, Shear strength, Sintering, Thermal conductivity",

author = "Hui Fang and Chenxi Wang and Te Wang and Hong Wang and Shicheng Zhou and Yilong Huang and Yanhong Tian",

note = "Publisher Copyright: {\textcopyright} 2019 Elsevier B.V.",

year = "2019",

month = dec,

day = "1",

doi = "10.1016/j.matlet.2019.126620",

language = "英语",

volume = "256",

journal = "Materials Letters",

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TY - JOUR

T1 - Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

AU - Fang, Hui

AU - Wang, Chenxi

AU - Wang, Te

AU - Wang, Hong

AU - Zhou, Shicheng

AU - Huang, Yilong

AU - Tian, Yanhong

PY - 2019/12/1

Y1 - 2019/12/1

N2 - A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 °C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation.

AB - A controllable plasma-activated method to achieve pressureless sintering of Ag nanoparticles is proposed for low-temperature bonding. O2 plasma activation is employed to effectively decompose organics coated on the nanoparticles prior to sintering, avoiding the loose interfacial microstructures. Therefore, robust bonding Cu-Cu joints with high shear strength (>20 MPa) can be formed at a low temperature of 200 °C without requiring additional pressure. This rapid and controllable activation method significantly enhances the sinterability of the Ag particles, leading to a dense microstructure. The improved thermal conductivity is three times higher than the one prepared without plasma activation.

KW - Low-temperature bonding

KW - Nanoparticles

KW - Plasma activation

KW - Shear strength

KW - Sintering

KW - Thermal conductivity

UR - https://www.scopus.com/pages/publications/85071853309

U2 - 10.1016/j.matlet.2019.126620

DO - 10.1016/j.matlet.2019.126620

M3 - 文章

AN - SCOPUS:85071853309

SN - 0167-577X

VL - 256

JO - Materials Letters

JF - Materials Letters

M1 - 126620

ER -

Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

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Keywords

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