Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan; Guisheng Zou; Ai Ping Wu; Jialie Ren; Jiuchun Yan; Anming Hu; Y. Zhou

doi:10.1016/j.scriptamat.2012.01.007

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan^*
, Guisheng Zou
, Ai Ping Wu
, Jialie Ren
, Jiuchun Yan^*
, Anming Hu
, Y. Zhou

^*Corresponding author for this work

School of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

210 Scopus citations

Abstract

We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.

Original language	English
Pages (from-to)	582-585
Number of pages	4
Journal	Scripta Materialia
Volume	66
Issue number	8
DOIs	https://doi.org/10.1016/j.scriptamat.2012.01.007
State	Published - Apr 2012

Keywords

Ag nanoparticle paste
Electronic packaging
Pressureless bonding
Sintering

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10.1016/j.scriptamat.2012.01.007

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title = "Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging",

abstract = "We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.",

keywords = "Ag nanoparticle paste, Electronic packaging, Pressureless bonding, Sintering",

author = "Jianfeng Yan and Guisheng Zou and Wu, \{Ai Ping\} and Jialie Ren and Jiuchun Yan and Anming Hu and Y. Zhou",

year = "2012",

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T1 - Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

AU - Yan, Jianfeng

AU - Zou, Guisheng

AU - Wu, Ai Ping

AU - Ren, Jialie

AU - Yan, Jiuchun

AU - Hu, Anming

AU - Zhou, Y.

PY - 2012/4

Y1 - 2012/4

N2 - We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.

AB - We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.

KW - Ag nanoparticle paste

KW - Electronic packaging

KW - Pressureless bonding

KW - Sintering

UR - https://www.scopus.com/pages/publications/84862795179

U2 - 10.1016/j.scriptamat.2012.01.007

DO - 10.1016/j.scriptamat.2012.01.007

M3 - 文章

AN - SCOPUS:84862795179

SN - 1359-6462

VL - 66

SP - 582

EP - 585

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Abstract

Keywords

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