Preparation of transparent conductive microstructures on curved substrates via laser-assisted transfer technology

The preparation of high-precision patterned transparent conductive materials on curved substrates presents challenges, including poor process compatibility and performance trade-offs. To address these issues, we propose a novel method based on laser-assisted transfer technology. Through a synergistic strategy of low-energy laser transfer and high-energy Ultraviolet (UV) laser curing, combined with the design of an ultra-thin transparent conductive UV-curable adhesive layer, the process achieves a balance between surface aptitude and optoelectronic performance through non-contact processing. The technology utilizes UV adhesive to penetrate the conductive network instead of hybrid coating, effectively avoiding nanowire damage and ensuring the continuity of conductivity between the microstructure and the curved substrate, with both high transmittance (>80 %@550 nm) and low resistivity (<100 Ω/sq). For the first time, multi-material microstructures such as metal mesh grids, inorganic oxide film, and organometallic halide perovskite have been fabricated on complex curved surfaces using laser-assisted transfer technology. Finally, the application potential of laser-assisted transfer technology is verified in scenarios such as the repair of aerospace electromagnetic shielding layers and the printing of invisible fluorescent 2D codes. Laser-assisted transfer technology provides versatile solutions for digital displays, biomedical sensing and smart optoelectronic device integration.