Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing

Zhijie Ye; Zhenhua Su; Kunlong Zhao; Xiaolei Wang; Wenxin Cao; Bing Dai; Ning Yan; Shuai Xu; Zhiqiang Wang; Jiaqi Zhu

doi:10.1016/j.matlet.2023.133894

Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing

Zhijie Ye
, Zhenhua Su
, Kunlong Zhao
, Xiaolei Wang
, Wenxin Cao^*
, Bing Dai
, Ning Yan
, Shuai Xu
, Zhiqiang Wang
, Jiaqi Zhu

^*Corresponding author for this work

School of Astronautics

Harbin Institute of Technology
Zhengzhou Research Institute for Abrasives & Grinding Co. LTD

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

Diamond/copper composites exhibit excellent thermophysical properties and demonstrate wide potential for heat dissipation applications. However, due to high hardness, it's difficult to process complex shape parts. To overcome the challenge, this study proposes the isostatic pressure technique. A pressureless sintering combined with cold and hot isostatic pressing is employed to prepare shaped diamond/copper composites with thermal conductivity reaching 620 W/mK, which is 57 % higher than that of pure copper. Cold isostatic pressing is used to enhance the density of the skeleton, followed by pressureless sintering to change the pore structure from open hole to closed hole. Finally, hot isostatic pressing is employed to eliminate the closed holes, thus improving the comprehensive performance of the composite.

Original language	English
Article number	133894
Journal	Materials Letters
Volume	336
DOIs	https://doi.org/10.1016/j.matlet.2023.133894
State	Published - 1 Apr 2023

Keywords

Diamond/copper composites
Interfaces
Isostatic pressing
Thermal properties

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10.1016/j.matlet.2023.133894

Cite this

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title = "Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing",

abstract = "Diamond/copper composites exhibit excellent thermophysical properties and demonstrate wide potential for heat dissipation applications. However, due to high hardness, it's difficult to process complex shape parts. To overcome the challenge, this study proposes the isostatic pressure technique. A pressureless sintering combined with cold and hot isostatic pressing is employed to prepare shaped diamond/copper composites with thermal conductivity reaching 620 W/mK, which is 57 \% higher than that of pure copper. Cold isostatic pressing is used to enhance the density of the skeleton, followed by pressureless sintering to change the pore structure from open hole to closed hole. Finally, hot isostatic pressing is employed to eliminate the closed holes, thus improving the comprehensive performance of the composite.",

keywords = "Diamond/copper composites, Interfaces, Isostatic pressing, Thermal properties",

author = "Zhijie Ye and Zhenhua Su and Kunlong Zhao and Xiaolei Wang and Wenxin Cao and Bing Dai and Ning Yan and Shuai Xu and Zhiqiang Wang and Jiaqi Zhu",

note = "Publisher Copyright: {\textcopyright} 2023 Elsevier B.V.",

year = "2023",

month = apr,

day = "1",

doi = "10.1016/j.matlet.2023.133894",

language = "英语",

volume = "336",

journal = "Materials Letters",

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publisher = "Elsevier B.V.",

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TY - JOUR

T1 - Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing

AU - Ye, Zhijie

AU - Su, Zhenhua

AU - Zhao, Kunlong

AU - Wang, Xiaolei

AU - Cao, Wenxin

AU - Dai, Bing

AU - Yan, Ning

AU - Xu, Shuai

AU - Wang, Zhiqiang

AU - Zhu, Jiaqi

PY - 2023/4/1

Y1 - 2023/4/1

N2 - Diamond/copper composites exhibit excellent thermophysical properties and demonstrate wide potential for heat dissipation applications. However, due to high hardness, it's difficult to process complex shape parts. To overcome the challenge, this study proposes the isostatic pressure technique. A pressureless sintering combined with cold and hot isostatic pressing is employed to prepare shaped diamond/copper composites with thermal conductivity reaching 620 W/mK, which is 57 % higher than that of pure copper. Cold isostatic pressing is used to enhance the density of the skeleton, followed by pressureless sintering to change the pore structure from open hole to closed hole. Finally, hot isostatic pressing is employed to eliminate the closed holes, thus improving the comprehensive performance of the composite.

AB - Diamond/copper composites exhibit excellent thermophysical properties and demonstrate wide potential for heat dissipation applications. However, due to high hardness, it's difficult to process complex shape parts. To overcome the challenge, this study proposes the isostatic pressure technique. A pressureless sintering combined with cold and hot isostatic pressing is employed to prepare shaped diamond/copper composites with thermal conductivity reaching 620 W/mK, which is 57 % higher than that of pure copper. Cold isostatic pressing is used to enhance the density of the skeleton, followed by pressureless sintering to change the pore structure from open hole to closed hole. Finally, hot isostatic pressing is employed to eliminate the closed holes, thus improving the comprehensive performance of the composite.

KW - Diamond/copper composites

KW - Interfaces

KW - Isostatic pressing

KW - Thermal properties

UR - https://www.scopus.com/pages/publications/85149806394

U2 - 10.1016/j.matlet.2023.133894

DO - 10.1016/j.matlet.2023.133894

M3 - 文章

AN - SCOPUS:85149806394

SN - 0167-577X

VL - 336

JO - Materials Letters

JF - Materials Letters

M1 - 133894

ER -

Preparation of high thermal conductivity shaped diamond/copper composites by isostatic pressing

Abstract

Keywords

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