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Preparation of conductive Cu patterns by directly writing using nano-Cu ink

  • Wei Li
  • , Wenjiang Li
  • , Jun Wei
  • , Junjun Tan
  • , Minfang Chen*
  • *Corresponding author for this work
  • Tianjin University
  • Tianjin University of Technology
  • Hubei University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Conductive and air-stable Cu patterns were directly made on ordinary photo paper using a roller pen filled with nano-Cu ink, which was mainly composed of metallic Cu nanoparticles (NPs) capped with poly(N-vinylpyrrolidone) (PVP). The nano-Cu NPs were obtained via the reduction of Cu2+ ions by using an excess of hydrazine and PVP. The low sintering temperature (160 °C) in Ar atmosphere played an important role for the preparation of air-stable Cu patterns. The conductivity of a radio-frequency identification antenna made from nano-Cu ink was tested by a lamp, and its resistivity achieved 13.4 ± 0.4 μΩ cm. The Cu NPs were confirmed by means of X-ray powder diffraction and X-ray photoelectron spectra, and the Cu patterns were characterized by scanning electron microscopy and energy dispersive X-ray spectrometry. A mechanism for the high conductivity of the Cu pattern made from Cu NPs is proposed.

Original languageEnglish
Pages (from-to)82-87
Number of pages6
JournalMaterials Chemistry and Physics
Volume146
Issue number1-2
DOIs
StatePublished - 15 Jul 2014
Externally publishedYes

Keywords

  • Electrical conductivity
  • Microstructure
  • Oxidation
  • Sintering

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