Preparation and properties of Pd colloids catalyst for direct copper plating

It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating electroless plating. The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless. Ultraviolet-visible absorption spectrometry, NanoPhox, and stereoscopic microscopy were used to characterize the colloids. The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. In order to enhance the dispersivity and minimize the particle size, vanillin was added to colloids solution in the present investigation.