TY - GEN
T1 - Preparation and microstructure of functionally gradient diamond/SAC composite solder bumps
AU - Ying, Zhong
AU - Wei, Zhang
AU - Chunqing, Wang
AU - Chunyu, Wang
AU - Bin, Li
PY - 2011
Y1 - 2011
N2 - With the method of copper-coating 100μm Diamonds was added into Sn3.0Ag0.5Cu(SAC305) solder to acquire Diamond/SAC305 composite solder bumps on Cu pad, which is considered to be a potential material to improve the thermal management of HB-LEDs, on account of the favorable conducting property of diamonds. Not only was a relatively high (7 wt. %) and controllable addition amount of diamonds achieved, but also a much better outlook of the solder bumps was observed. What's more, spreading areas of the new solder were calculated and shear strengths of the bumps were measured. Spreading area went up and down respectively before and after the diamond additions was 3wt%. Meanwhile the shear strength fluctuated with peaks at lwt% and 7wt%. The distribution of diamonds was observed as centralizing mainly at the interface between the solder and the Cu pad, making up a special enhanced interface character as a kind of functionally gradient (FG) solder bump.
AB - With the method of copper-coating 100μm Diamonds was added into Sn3.0Ag0.5Cu(SAC305) solder to acquire Diamond/SAC305 composite solder bumps on Cu pad, which is considered to be a potential material to improve the thermal management of HB-LEDs, on account of the favorable conducting property of diamonds. Not only was a relatively high (7 wt. %) and controllable addition amount of diamonds achieved, but also a much better outlook of the solder bumps was observed. What's more, spreading areas of the new solder were calculated and shear strengths of the bumps were measured. Spreading area went up and down respectively before and after the diamond additions was 3wt%. Meanwhile the shear strength fluctuated with peaks at lwt% and 7wt%. The distribution of diamonds was observed as centralizing mainly at the interface between the solder and the Cu pad, making up a special enhanced interface character as a kind of functionally gradient (FG) solder bump.
UR - https://www.scopus.com/pages/publications/81355142641
U2 - 10.1109/ICEPT.2011.6066816
DO - 10.1109/ICEPT.2011.6066816
M3 - 会议稿件
AN - SCOPUS:81355142641
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 178
EP - 182
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -