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Preparation and microstructure of CuNiTiZr medium-entropy alloy coatings on TC11 substrate via electrospark – computer numerical control deposition process

  • Xiao Rong Wang*
  • , Zhao Qin Wang
  • , Wen Sheng Li
  • , Tie Song Lin
  • , Peng He
  • , Chang Hong Tong
  • *Corresponding author for this work
  • Lanzhou Jiaotong University
  • Harbin Institute of Technology
  • Lanzhou University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

The CuNiTiZr medium-entropy alloy coatings were produced on TC11 titanium alloy substrate using the electrospark – computer numerical control deposition (ES-CNCD) process. The microstructure of the deposited coatings transforms from a BCC solid solution into an amorphous phase with the increase of the deposition layer number. The transformation is attributed to the high cooling rate of ES-CNCD and the increased atomic size difference (δ) of the coatings. The hardness of the 1/3/5/7/9-layer CuNiTiZr coatings are 614.1 HV, 484.2 HV, 588.5 HV, 709.1 HV and 581.2 HV, respectively, which are far greater than the hardness of TC11 (378.6 HV).

Original languageEnglish
Pages (from-to)143-145
Number of pages3
JournalMaterials Letters
Volume197
DOIs
StatePublished - 15 Jun 2017

Keywords

  • Amorphous materials
  • Deposition
  • Medium-entropy alloy coating
  • Microstructure
  • Solid solution

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