@inproceedings{5b148d8e10e94a979b1876d80d047cc9,
title = "Prediction of solder joint geometry for optical fiber attachment assembly in direct-coupling applications",
abstract = "Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. The three-dimensional shape of solder joint in fiber attachment soldering was predicted by using the public domain software called Surface Evolver. The influences of material and manufacturing parameters on solder joint geometry and the stand-off height were investigated. The results can be used to control the solder joint geometry and to improve the alignment of optical fiber.",
author = "Wei Zhang and Chunqing Wang and Yanhong Tian",
year = "2005",
doi = "10.1109/ICEPT.2005.1564649",
language = "英语",
isbn = "0780394496",
series = "2005 6th International Conference on Electronics Packaging Technology",
booktitle = "2005 6th International Conference on Electronics Packaging Technology",
note = "2005 6th International Conference on Electronics Packaging Technology ; Conference date: 30-08-2005 Through 02-09-2005",
}