Prediction of effective thermomechanical behavior of shape memory polymer composite with micro-damage interface

Shape memory polymer composite (SMPC) not only retains the unique stimuli-responsive ability of shape memory polymer (SMP), but also enhances the thermomechanical behavior of SMP. Although relatively complete thermal prediction models of SMPC have been established, the displacement jump due to interface damage has hardly been considered in these models. In this work, the thermomechanical constitutive model of SMPC considering the interface and micro-damage behavior is derived. The effective mechanical behaviors of SMPC under different temperatures and damage conditions are deduced by modifying Eshelby tensor and Mori-Tanaka method. Taking MWCNT/SMP composite as an example, the reliability of the model is verified by the thermomechanical coupling tests. More importantly, the model can also predict other reinforced types of SMPC by changing the configuration parameters and physical properties of the reinforcement phase.