Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

Chong Wang; Maozhong An; Peixia Yang; Jinqiu Zhang

doi:10.1016/j.elecom.2012.02.028

Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

Chong Wang
, Maozhong An^*
, Peixia Yang
, Jinqiu Zhang

^*Corresponding author for this work

School of Chemistry and Chemical Engineering, Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

74 Scopus citations

Abstract

Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP ₁₄Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP ₁₄Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP ₁₄Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.

Original language	English
Pages (from-to)	104-107
Number of pages	4
Journal	Electrochemistry Communications
Volume	18
Issue number	1
DOIs	https://doi.org/10.1016/j.elecom.2012.02.028
State	Published - 2012
Externally published	Yes

Keywords

Electroplating
Leveler
Molecular dynamics simulations
N-butyl-methyl piperidinium bromide
Through-hole

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10.1016/j.elecom.2012.02.028

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title = "Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations",

abstract = "Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP 14Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP 14Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP 14Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.",

keywords = "Electroplating, Leveler, Molecular dynamics simulations, N-butyl-methyl piperidinium bromide, Through-hole",

author = "Chong Wang and Maozhong An and Peixia Yang and Jinqiu Zhang",

year = "2012",

doi = "10.1016/j.elecom.2012.02.028",

language = "英语",

volume = "18",

pages = "104--107",

journal = "Electrochemistry Communications",

issn = "1388-2481",

publisher = "Elsevier Inc.",

number = "1",

}

TY - JOUR

T1 - Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

AU - Wang, Chong

AU - An, Maozhong

AU - Yang, Peixia

AU - Zhang, Jinqiu

PY - 2012

Y1 - 2012

N2 - Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP 14Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP 14Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP 14Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.

AB - Adsorption behaviors of N-butyl-methyl piperidinium bromide (PP 14Br) at Cu (001) surface under different electric fields were investigated using molecular dynamics (MD) simulations. We predicted PP 14Br could be used as a new leveler for through-hole copper electroplating. In the through-hole electroplating experiments, PP 14Br was employed as a leveler. The results of electroplating confirmed the prediction. The electrochemical tests were characterized by potentiodynamic polarization and galvanostatic measurements using rotating disk electrode operated at 100 and 1000 rpm.

KW - Electroplating

KW - Leveler

KW - Molecular dynamics simulations

KW - N-butyl-methyl piperidinium bromide

KW - Through-hole

UR - https://www.scopus.com/pages/publications/84860524084

U2 - 10.1016/j.elecom.2012.02.028

DO - 10.1016/j.elecom.2012.02.028

M3 - 文章

AN - SCOPUS:84860524084

SN - 1388-2481

VL - 18

SP - 104

EP - 107

JO - Electrochemistry Communications

JF - Electrochemistry Communications

IS - 1

ER -

Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations

Abstract

Keywords

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