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Precision machining of silicon carbide with coarse-grained diamond wheels

  • Q. L. Zhao*
  • , Y. C. Liang
  • , E. Brinksmeier
  • , O. Riemer
  • , K. Rickens
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • University of Bremen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An advanced conditioning technique was developed to precisely and effectively condition the nickel electroplated mono-layer coarse-grained diamond grinding wheel of 46ìm and 91ìm grain size, to meet the high demands of form accuracy, surface quality and low subsurface damage in ductile machining of silicon carbide (SiC). The precision machining experiments on SiC were carried out on a precision grinder to determine the applicability of these conditioned coarse-grained diamond wheels. The experimental result indicates that the well conditioned diamond wheels are applicable and feasible to realize ductile machining on SiC with high efficiency and low diamond tool wear rate, which illustrates a good prospect to apply this new concept diamond tool type in precision machining of SiC, as well as the other brittle and hard-to-machine materials.

Original languageEnglish
Title of host publicationProceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
EditorsE. Thornett
Publishereuspen
Pages277-280
Number of pages4
ISBN (Electronic)0955308224, 9780955308222
StatePublished - 2007
Event7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007 - Bremen, Germany
Duration: 20 May 200724 May 2007

Publication series

NameProceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
Volume2

Conference

Conference7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
Country/TerritoryGermany
CityBremen
Period20/05/0724/05/07

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