Abstract
New technologies mushroomed in various new applications of power electronics are introduced, including high temperature applications such as SiC devices, various cooling methods, power module and thermoelectric modular (TEM), as well as low temperature utilities such as cryogenic power circuit, high temperature superconductor (HTS). The future trend of power electronics in extreme temperature environment is also pointed out.
| Original language | English |
|---|---|
| Pages (from-to) | 15-23 |
| Number of pages | 9 |
| Journal | Diangong Jishu Xuebao/Transactions of China Electrotechnical Society |
| Volume | 21 |
| Issue number | 3 |
| State | Published - Mar 2006 |
Keywords
- Cooling methods
- Cryogenic power electronics
- Extreme temperature
- HTS
- Power electronics
- SiC
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