Powder metallurgy process enables production of high-strength conductive Cu-based composites reinforced by Cu₅₀Zr₄₃Al₇ metallic glass

This study showcases the preparation of Cu₅₀Zr₄₃Al₇ metallic glass-reinforced ultrafine grain copper matrix composites using a powder metallurgical process to achieve a superior combination of strength and electrical conductivity. The mechanical ball milling (BM) process is utilized to effectively refine the Cu matrix grains to the nanoscale. Furthermore, high-pressure spark plasma sintering (SPS) is employed to prevent grain growth and improve the interface bonding between two phases. Increasing the Cu₅₀Zr₄₃Al₇ addition content improved the mechanical properties under a load transfer strengthening strategy. Notably, the 20 wt% Cu₅₀Zr₄₃Al₇/Cu composite demonstrates excellent mechanical properties and high electrical conductivity. This is attributed to the uniformly-dispersed Cu₅₀Zr₄₃Al₇ metallic glass particles in the ultrafine grain Cu matrix with well-established interfacial bonding. The synergistic strengthening of the Cu₅₀Zr₄₃Al₇/Cu composites represents a novel choice for switch contact materials application, maintaining excellent mechanical properties while satisfying conductive requirements.