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Planar parallel manipulator based MEMS device bonding system

  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Aimed at the high velocity, high precision and high flexibility requirements, a manipulator of planar parallel structure is developed to substitute for ordinary X - Y table, in addition the machine vision is implemented to improve the system's flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm, then the manipulator's absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device's geometry model, which is the base to do off-line programming. An ideal trade-off between the system's flexibility and efficiency is got.

Original languageEnglish
Pages (from-to)386-389
Number of pages4
JournalHarbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology
Volume39
Issue number3
StatePublished - Mar 2007

Keywords

  • Kalman filtering
  • Lead bonding
  • Micro electro mechanical system
  • Parameter estimation

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