Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect

K. Q. Hu; S. A. Meguid; Z. Zhong; C. F. Gao

doi:10.1007/s10999-020-09500-2

Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect

K. Q. Hu
, S. A. Meguid^*
, Z. Zhong
, C. F. Gao

^*Corresponding author for this work

Nanjing University of Aeronautics and Astronautics
University of Toronto
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

In this first effort, a partially-debonded circular inclusion in a one-dimensional quasicrystal material with piezoelectric effect is studied. This mixed boundary value problem of a circular interface crack is reduced to solving three Riemann–Hilbert problems with the use of analytical continuation theory. The crack-tip singularity of the circular interface crack is investigated and the intensity factors of the stresses in the phonon and the phason fields and electric displacements are derived explicitly. Some particular cases are provided to show the effect of the crack angle, material properties and loadings on the field singularities at the tips of the circular interface crack.

Original language	English
Pages (from-to)	749-766
Number of pages	18
Journal	International Journal of Mechanics and Materials in Design
Volume	16
Issue number	4
DOIs	https://doi.org/10.1007/s10999-020-09500-2
State	Published - Dec 2020
Externally published	Yes

Keywords

Circular interface crack
Crack-tip singularities
Piezoelectric effect
Quasicrystal material
Riemann–Hilbert problems

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10.1007/s10999-020-09500-2

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title = "Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect",

abstract = "In this first effort, a partially-debonded circular inclusion in a one-dimensional quasicrystal material with piezoelectric effect is studied. This mixed boundary value problem of a circular interface crack is reduced to solving three Riemann–Hilbert problems with the use of analytical continuation theory. The crack-tip singularity of the circular interface crack is investigated and the intensity factors of the stresses in the phonon and the phason fields and electric displacements are derived explicitly. Some particular cases are provided to show the effect of the crack angle, material properties and loadings on the field singularities at the tips of the circular interface crack.",

keywords = "Circular interface crack, Crack-tip singularities, Piezoelectric effect, Quasicrystal material, Riemann–Hilbert problems",

author = "Hu, \{K. Q.\} and Meguid, \{S. A.\} and Z. Zhong and Gao, \{C. F.\}",

note = "Publisher Copyright: {\textcopyright} 2020, Springer Nature B.V.",

year = "2020",

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doi = "10.1007/s10999-020-09500-2",

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volume = "16",

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TY - JOUR

T1 - Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect

AU - Hu, K. Q.

AU - Meguid, S. A.

AU - Zhong, Z.

AU - Gao, C. F.

PY - 2020/12

Y1 - 2020/12

N2 - In this first effort, a partially-debonded circular inclusion in a one-dimensional quasicrystal material with piezoelectric effect is studied. This mixed boundary value problem of a circular interface crack is reduced to solving three Riemann–Hilbert problems with the use of analytical continuation theory. The crack-tip singularity of the circular interface crack is investigated and the intensity factors of the stresses in the phonon and the phason fields and electric displacements are derived explicitly. Some particular cases are provided to show the effect of the crack angle, material properties and loadings on the field singularities at the tips of the circular interface crack.

AB - In this first effort, a partially-debonded circular inclusion in a one-dimensional quasicrystal material with piezoelectric effect is studied. This mixed boundary value problem of a circular interface crack is reduced to solving three Riemann–Hilbert problems with the use of analytical continuation theory. The crack-tip singularity of the circular interface crack is investigated and the intensity factors of the stresses in the phonon and the phason fields and electric displacements are derived explicitly. Some particular cases are provided to show the effect of the crack angle, material properties and loadings on the field singularities at the tips of the circular interface crack.

KW - Circular interface crack

KW - Crack-tip singularities

KW - Piezoelectric effect

KW - Quasicrystal material

KW - Riemann–Hilbert problems

UR - https://www.scopus.com/pages/publications/85085599744

U2 - 10.1007/s10999-020-09500-2

DO - 10.1007/s10999-020-09500-2

M3 - 文章

AN - SCOPUS:85085599744

SN - 1569-1713

VL - 16

SP - 749

EP - 766

JO - International Journal of Mechanics and Materials in Design

JF - International Journal of Mechanics and Materials in Design

IS - 4

ER -

Partially debonded circular inclusion in one-dimensional quasicrystal material with piezoelectric effect

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Keywords

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