Abstract
Thermoplastic resins have contributed more and more to the field of fiber reinforced composites. The ability to fabricate fiber reinforced thermoplastic resin composites with excellent and functional interface performances has so far been elusive. Herein, we use a polyamide-imide (PAI)/Ti3C2Tx MXene sizing to enhance the interfacial performance of CF reinforced polyetheretherketone (PEEK) composites. The composite sizing makes the composite with high interfacial adhesion and electromagnetic interference (EMI) shielding performances. Our results indicate that traditional composite materials can improve performance and increase functionality through interface treatment.
| Original language | English |
|---|---|
| Article number | 108496 |
| Journal | Composites Science and Technology |
| Volume | 201 |
| DOIs | |
| State | Published - 5 Jan 2021 |
| Externally published | Yes |
Keywords
- CF/PEEK
- Electromagnetic interference shielding
- Polyamide-imide (PAI)
- TiCT MXene
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