Optimized wire bonding process on micro-connection pad with Ni/CeO2 coatings

Wang Chunyu; Wang Qing; Li Han-Zhu; Ji Xiao-Zhi; Kang Zhi-Long

doi:10.4028/www.scientific.net/AMM.275-277.1925

Optimized wire bonding process on micro-connection pad with Ni/CeO₂ coatings

Wang Chunyu^*
, Wang Qing
, Li Han-Zhu
, Ji Xiao-Zhi
, Kang Zhi-Long

^*Corresponding author for this work

School of Materials Science and Engineering, Harbin Institute of Technology Weihai

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

It is Ni/CeO₂ coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO₂ conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.

Original language	English
Title of host publication	Applied Mechanics and Materials I
Pages	1925-1928
Number of pages	4
DOIs	https://doi.org/10.4028/www.scientific.net/AMM.275-277.1925
State	Published - 2013
Externally published	Yes
Event	2012 International Conference on Applied Mechanics and Materials, ICAMM 2012 - Sanya, China Duration: 24 Nov 2012 → 25 Nov 2012

Publication series

Name	Applied Mechanics and Materials
Volume	275-277
ISSN (Print)	1660-9336
ISSN (Electronic)	1662-7482

Conference

Conference	2012 International Conference on Applied Mechanics and Materials, ICAMM 2012
Country/Territory	China
City	Sanya
Period	24/11/12 → 25/11/12

Keywords

Ceo
Electroless plating Ni
Micro-connection pad
Wire bonding

Access to Document

10.4028/www.scientific.net/AMM.275-277.1925

Cite this

@inproceedings{0eed6de77e7344489f7ee18185cfa69d,

title = "Optimized wire bonding process on micro-connection pad with Ni/CeO2 coatings",

abstract = "It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.",

keywords = "Ceo, Electroless plating Ni, Micro-connection pad, Wire bonding",

author = "Wang Chunyu and Wang Qing and Li Han-Zhu and Ji Xiao-Zhi and Kang Zhi-Long",

year = "2013",

doi = "10.4028/www.scientific.net/AMM.275-277.1925",

language = "英语",

isbn = "9783037855911",

series = "Applied Mechanics and Materials",

pages = "1925--1928",

booktitle = "Applied Mechanics and Materials I",

note = "2012 International Conference on Applied Mechanics and Materials, ICAMM 2012 ; Conference date: 24-11-2012 Through 25-11-2012",

}

Chunyu, W, Qing, W, Han-Zhu, L, Xiao-Zhi, J & Zhi-Long, K 2013, Optimized wire bonding process on micro-connection pad with Ni/CeO₂ coatings. in Applied Mechanics and Materials I. Applied Mechanics and Materials, vol. 275-277, pp. 1925-1928, 2012 International Conference on Applied Mechanics and Materials, ICAMM 2012, Sanya, China, 24/11/12. https://doi.org/10.4028/www.scientific.net/AMM.275-277.1925

TY - GEN

T1 - Optimized wire bonding process on micro-connection pad with Ni/CeO2 coatings

AU - Chunyu, Wang

AU - Qing, Wang

AU - Han-Zhu, Li

AU - Xiao-Zhi, Ji

AU - Zhi-Long, Kang

PY - 2013

Y1 - 2013

N2 - It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.

AB - It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.

KW - Ceo

KW - Electroless plating Ni

KW - Micro-connection pad

KW - Wire bonding

UR - https://www.scopus.com/pages/publications/84873374878

U2 - 10.4028/www.scientific.net/AMM.275-277.1925

DO - 10.4028/www.scientific.net/AMM.275-277.1925

M3 - 会议稿件

AN - SCOPUS:84873374878

SN - 9783037855911

T3 - Applied Mechanics and Materials

SP - 1925

EP - 1928

BT - Applied Mechanics and Materials I

T2 - 2012 International Conference on Applied Mechanics and Materials, ICAMM 2012

Y2 - 24 November 2012 through 25 November 2012

ER -