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Optimization of technological parameters for diffusion bonding Al2O3 ceramics to aluminum alloy

  • Da Yang Wang*
  • , Ji Cai Feng
  • , Hui Jie Liu
  • , Zhou Ran Li
  • *Corresponding author for this work
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

This paper establishes a mathematical model to optimize technological parameters for diffusion bonding Al2O3 ceramics to Al alloy with a Cu layer sintered beforehand. By using the mathematical model, a regression equation for calculating the optimal comprehensive strength of joints is obtained and the optimized parameters are obtained as follows: T=777 K, t=1226 s, at which the tensile strength and the shear strength of joints can reach to 108 MPa and 45 MPa respectively. The experiments confirm that the above strength values are similar to the highest tensile value and the highest shear strength value of joints, and show that the mathematical model is effective to optimize technological parameters of diffusion bonding Al2O3 ceramics to Al alloy.

Original languageEnglish
Pages (from-to)73-76
Number of pages4
JournalCailiao Kexue yu Gongyi/Material Science and Technology
Volume11
Issue number1
StatePublished - Mar 2003

Keywords

  • Al alloy
  • AlO
  • Diffusion bonding
  • Optimizing

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