Abstract
This paper establishes a mathematical model to optimize technological parameters for diffusion bonding Al2O3 ceramics to Al alloy with a Cu layer sintered beforehand. By using the mathematical model, a regression equation for calculating the optimal comprehensive strength of joints is obtained and the optimized parameters are obtained as follows: T=777 K, t=1226 s, at which the tensile strength and the shear strength of joints can reach to 108 MPa and 45 MPa respectively. The experiments confirm that the above strength values are similar to the highest tensile value and the highest shear strength value of joints, and show that the mathematical model is effective to optimize technological parameters of diffusion bonding Al2O3 ceramics to Al alloy.
| Original language | English |
|---|---|
| Pages (from-to) | 73-76 |
| Number of pages | 4 |
| Journal | Cailiao Kexue yu Gongyi/Material Science and Technology |
| Volume | 11 |
| Issue number | 1 |
| State | Published - Mar 2003 |
Keywords
- Al alloy
- AlO
- Diffusion bonding
- Optimizing
Fingerprint
Dive into the research topics of 'Optimization of technological parameters for diffusion bonding Al2O3 ceramics to aluminum alloy'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver