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Optimization of smart adhesively bonded single-strap composite joint

  • Jinquan Cheng*
  • , Su Seng Pang
  • , Guoqiang Li
  • , Zhen Gong Zhou
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

In order to reduce the stress concentration and improve the failure strength of adhesively bonded joint structures, a smart adhesively bonded joint structure has been developed by integrating piezoelectric layers into the adherends. For better design guide, a combined theoretical model and multi-objective optimization approach is employed to optimize the smart joint in this study. Firstly, the first-order shear deformation theory is utilized to model and analyze the detailed peel and shear stresses distribution in the adhesive layer. Further, considering the characteristics of the stress distribution, the interface debonding failure criterion is used to set up the objective; optimization variables are considered as the stacking sequence, geometries and applied electric fields of the integrated piezoelectric layer. Thus, with the aid of the Mathematica software, the optimal smart adhesively bonded joint system can be determined. Finally, some detailed examples are analytically solved to show the considerable difference between the preoptimized and optimized smart joint systems, which validate that the developed theoretical model and multi-objective optimization approach can be used to enhance adhesively bonded joint failure strength.

Original languageEnglish
Pages (from-to)879-895
Number of pages17
JournalJournal of Adhesion Science and Technology
Volume27
Issue number8
DOIs
StatePublished - 1 Apr 2013

Keywords

  • adhesive joint
  • composites
  • joint design
  • smart materials and structures
  • stress analysis

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