Optimization design of structural size of microchannel cooling heat sink

Aiming at the thermal resistance and pressure drop as two objective functions, the multiobjective optimization model of the microchannel cooling heat sink was built. The sequential quadratic programming (SQP) method was used to optimize the structural sizes of microchannel. The optimization results show that the thermal transfer performance of microchannel cooling heat sinks is affected intensively by their structural shape, and compared with triangle and trapezoid shape, rectangle structure has better thermal transfer performance. Two sets of optimized sizes under two sets of different weighting coefficients were given, and the corresponding width of channel were 130 and 120 μm, and fin width were 176 and 350 μm, and height were 640 and 1000 μm, and the thermal resistance were 0.4857 and 0.5094 K/W, respectively. The numerical simulation of the fluid flow and the thermal transfer of the above optimized structure shows that the highest temperatures of chips were 358.34 and 361.52 K, respectively, meeting the requirement of the chip for the work temperature.