Optimization Design of Sound Field Radiation Simulation for Nanochip Megasonic Cleaning Transducers Based on Comsol

With the rapid development of the semiconductor industry, cleaning is widely used in fields such as chip manufacturing. Cleaning, as an important component of chip manufacturing processes, plays a crucial role in achieving nanoscale precision in chips. However, in the process of chip manufacturing, various pollutants and small particles are often adhered to the surface of the chip, which directly affect the quality and stability of the chip manufacturing process. Therefore, cleaning the chip has become particularly important. In the cleaning of nanochips, megasonic technology has demonstrated its unique advantages. Megasonic cleaning can remove small particles smaller than 0.2 g m and avoid potential damage to the surface of objects caused by cavitation. However, the distribution of water acoustic fields varies greatly among different matching layers. In order to further improve the cleaning efficiency of the nanochip megaacoustic cleaning transducer, increase the sound pressure in the water, and reduce the loss during energy transfer, this paper uses the finite element software Comsol to analyze the water acoustic field of the nanochip megaacoustic transducer. The influence of matching layer material and transducer oscillator structure size on the water acoustic pressure of the nanochip megaacoustic cleaning transducer is studied, and based on the analysis results, the optimized design of the nanochip megaacoustic transducer is carried out. The optimization results show that the spray type megaacoustic transducer with quartz as the matching layer has a greater water pressure amplitude than the water pressure amplitude with steel and aluminum as the matching layer, and still has a strong sound field intensity at a longer propagation distance, effectively reducing energy loss during the transmission process.