@inproceedings{3d9bd943f76a40f09901f209bc1cb358,
title = "On-line hardness characterization of novel 2-mil copper bonding wires",
abstract = "In order to eliminate the chip cratering for copper wire applications in IC packaging, it is worthwhile to develop new Cu wire chemistries to obtain a son copper wire with a son free-air ball (FAB). The conventional hardness characterization of a new bonding wire is a labour intensive, time-consuming work. Therefore an on-line hardness characterization method is presented that enables the hardness comparison of a larger number of different wires within a shorter time. The influences of capillary change, bonding substrate metallization and temperature on this method is quantified. It is found these influences need to be held constant during a hardness comparison study. With this method, the wire and FAB hardness comparison of nine novel 2-mil copper bonding wires, Cu 1 to Cu 9, and one 2-mil Au wire are performed. The wire hardness (wireside) and FAB hardness are characterized. It is found that the Cu 4 and Cu 5 have the softest wireside hardness and FAB hardness.",
keywords = "Copper wire, Free-air ball, Hardness, On-line, Thermosonic, Wire bonding",
author = "Hang, \{C. J.\} and I. Lum and J. Lee and M. Mayer and Y. Zhou and Wang, \{C. Q.\} and Hong, \{S. J.\} and Lee, \{S. M.\}",
year = "2007",
doi = "10.1115/IPACK2007-33046",
language = "英语",
isbn = "0791842770",
series = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",
pages = "25--30",
booktitle = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",
note = "ASME Electronic and Photonics Packaging Division ; Conference date: 08-07-2007 Through 12-07-2007",
}