Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope

Hongjun Ji; Mingyu Li; Younggak Kweon; Woongseong Chang; Chunqing Wang

doi:10.1109/ICEPT.2007.4441433

Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope

Hongjun Ji^*
, Mingyu Li
, Younggak Kweon
, Woongseong Chang
, Chunqing Wang

^*Corresponding author for this work

School of Integrated Circuits

Harbin Institute of Technology Shenzhen
Research Institute of Industrial Science & Technology, Pohang
Harbin Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Due to small bond size, short bonding time, especially slight interface reaction, bonding details can not be recognized using scanning electron microscope and energy density x-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSil wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission electron microscope. Au₈Al₃ intermetallic compounds were identified by convergent beam electron diffraction, thickness of which was about 200nm and its lattice images were captured. Solid-state diffusion theory can not be used to explain why such thick compound formed within milliseconds at room temperature. Ultrasonic effects attributed to formation of the metallurgical bonds.

Original language	English
Title of host publication	Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs	https://doi.org/10.1109/ICEPT.2007.4441433
State	Published - 2007
Event	2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China Duration: 14 Aug 2007 → 17 Aug 2007

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2007 8th International Conference on Electronic Packaging Technology, ICEPT
Country/Territory	China
City	Shanghai
Period	14/08/07 → 17/08/07

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10.1109/ICEPT.2007.4441433

Cite this

Ji, H., Li, M., Kweon, Y., Chang, W., & Wang, C. (2007). Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope. In Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT Article 4441433 (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/ICEPT.2007.4441433

@inproceedings{5a3d82ee9e894a33ad0b3cd9a76624ec,

title = "Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope",

abstract = "Due to small bond size, short bonding time, especially slight interface reaction, bonding details can not be recognized using scanning electron microscope and energy density x-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSil wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission electron microscope. Au8Al3 intermetallic compounds were identified by convergent beam electron diffraction, thickness of which was about 200nm and its lattice images were captured. Solid-state diffusion theory can not be used to explain why such thick compound formed within milliseconds at room temperature. Ultrasonic effects attributed to formation of the metallurgical bonds.",

author = "Hongjun Ji and Mingyu Li and Younggak Kweon and Woongseong Chang and Chunqing Wang",

year = "2007",

doi = "10.1109/ICEPT.2007.4441433",

language = "英语",

isbn = "1424413923",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

booktitle = "Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT",

note = "2007 8th International Conference on Electronic Packaging Technology, ICEPT ; Conference date: 14-08-2007 Through 17-08-2007",

}

Ji, H , Li, M, Kweon, Y, Chang, W & Wang, C 2007, Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope. in Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT., 4441433, Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007 8th International Conference on Electronic Packaging Technology, ICEPT, Shanghai, China, 14/08/07. https://doi.org/10.1109/ICEPT.2007.4441433

Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope. / Ji, Hongjun ; Li, Mingyu; Kweon, Younggak et al.
Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 2007. 4441433 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope

AU - Ji, Hongjun

AU - Li, Mingyu

AU - Kweon, Younggak

AU - Chang, Woongseong

AU - Wang, Chunqing

PY - 2007

Y1 - 2007

N2 - Due to small bond size, short bonding time, especially slight interface reaction, bonding details can not be recognized using scanning electron microscope and energy density x-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSil wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission electron microscope. Au8Al3 intermetallic compounds were identified by convergent beam electron diffraction, thickness of which was about 200nm and its lattice images were captured. Solid-state diffusion theory can not be used to explain why such thick compound formed within milliseconds at room temperature. Ultrasonic effects attributed to formation of the metallurgical bonds.

AB - Due to small bond size, short bonding time, especially slight interface reaction, bonding details can not be recognized using scanning electron microscope and energy density x-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSil wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission electron microscope. Au8Al3 intermetallic compounds were identified by convergent beam electron diffraction, thickness of which was about 200nm and its lattice images were captured. Solid-state diffusion theory can not be used to explain why such thick compound formed within milliseconds at room temperature. Ultrasonic effects attributed to formation of the metallurgical bonds.

UR - https://www.scopus.com/pages/publications/50249188764

U2 - 10.1109/ICEPT.2007.4441433

DO - 10.1109/ICEPT.2007.4441433

M3 - 会议稿件

AN - SCOPUS:50249188764

SN - 1424413923

SN - 9781424413928

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT

T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT

Y2 - 14 August 2007 through 17 August 2007

ER -

Observation of ultrasonic Al-Si wire wedge bond interface using high resolution transmission electron microscope

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