@inproceedings{debcb4dad7394d4bbfbfb6bad90a2a80,
title = "Numerical study of the thermal thermopile flow sensor",
abstract = "This paper presents a numerical study of the critical dimension of the thermal thermopile flow sensor. According to the existing analysis model for verifying numerical results, the numerical and analytical results are consistent. Based on the verified simulation results, the effects of substrate thickness, flow channel height, distance between the hot point of the thermopile and the heater on the working range, and sensitivity was studied.",
keywords = "Critical dimension, Numerical study, Thermal thermopile flow sensor",
author = "Chaozhan Chen and Hong Hu and Wang, \{Jin Jin\}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 15th IEEE International Conference on Mechatronics and Automation, ICMA 2018 ; Conference date: 05-08-2018 Through 08-08-2018",
year = "2018",
month = oct,
day = "5",
doi = "10.1109/ICMA.2018.8484661",
language = "英语",
series = "Proceedings of 2018 IEEE International Conference on Mechatronics and Automation, ICMA 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "510--514",
booktitle = "Proceedings of 2018 IEEE International Conference on Mechatronics and Automation, ICMA 2018",
address = "美国",
}