Numerical simulation on temperature distribution of PBGA package during laser reflow process

In this paper, temperature distribution of PBGA component during laser reflow process of solder ball was simulated with finite element method, and effects of different heating means of laser on temperature distribution were discussed in detail. Results of simulation showed that reflowing solder balls with laser can not damage the silicon chip and package with the characters of short heating time and low temperature in package comparing with traditional heating method such as infrared reflow and hot air reflow method. At the same time, experiments on PBGA solder ball laser reflow were carried out. Results of experiment showed that surface of solder bump achieved by laser reflow method with proper parameters is much smoother than that achieved by hot air reflow method.