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Numerical simulation of temperature field and stress distributions in multi-Pass single-Layer weld-Based rapid prototyping

  • H. H. Zhao
  • , H. C. Li
  • , G. J. Zhang*
  • , Z. Q. Yin
  • , L. Wu
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The complicated temperature field distribution during multi-pass single-layer weldbased rapid prototyping induces complex thermal stress evolutions and residual stress distributions. In this paper, a three-dimensional finite element model with temperature-dependent material properties is presented to investigate the temperature field and thermal stress distributions in multi-pass single-layer weld-based rapid prototyping. The experiments of multipass single-layer weld-based rapid prototyping are carried out to measure the thermal cycles and residual stress distributions of the depositing component. The results show that the variation trends of simulated results are in agreement with the experimental results. In the depositing process of multi-pass single-layer weld-based rapid prototyping, the rear pass has the stress release effect on the fore passes, and the non-uniform multi-peak thermal cycle experienced during the depositing is the main cause of the stress release effect. The stress of the last pass plays a significant effect on the residual stress distribution of the whole component.

Original languageEnglish
Pages (from-to)402-409
Number of pages8
JournalReviews on Advanced Materials Science
Volume33
Issue number5
StatePublished - 2013

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