Numerical simulation of silicon micro flat heat pipes with axial triangle grooves

Wang Chao; Liu Xiaowei; Huo Mingxue; Xu Lei

doi:10.1109/ICSICT.2008.4735055

Numerical simulation of silicon micro flat heat pipes with axial triangle grooves

Wang Chao^*
, Liu Xiaowei
, Huo Mingxue
, Xu Lei

^*Corresponding author for this work

School of Astronautics

Harbin Institute of Technology
Heilongjiang University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

One-dimensional model is developed and solved numerically to investigate the flow of liquid and vapor in triangle grooves. The effect of liquid and vapor interfacial shear stress is taken into account in this model that can greatly improve the accuracy of the results. The results obtained from this simulation contain behaviors of pressure and flow patterns, the effect of different working conditions and so forth. In addition, maximum heat transport capacity of micro heat pipe is calculated. The model predicted results are successfully compared with the experimental results from the published results in literature. The general nature of the model and the associated parametric study ensure the wide applicability of the model.

Original language	English
Title of host publication	ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
Pages	2403-2407
Number of pages	5
DOIs	https://doi.org/10.1109/ICSICT.2008.4735055
State	Published - 2008
Event	2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 - Beijing, China Duration: 20 Oct 2008 → 23 Oct 2008

Publication series

Name	International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

Conference

Conference	2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
Country/Territory	China
City	Beijing
Period	20/10/08 → 23/10/08

Keywords

Maximum heat transport capacity
Micro groove
Numerical simulation
Silicon micro flat heat pipe

Access to Document

10.1109/ICSICT.2008.4735055

Cite this

Chao, W., Xiaowei, L., Mingxue, H., & Lei, X. (2008). Numerical simulation of silicon micro flat heat pipes with axial triangle grooves. In ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings (pp. 2403-2407). Article 4735055 (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT). https://doi.org/10.1109/ICSICT.2008.4735055

@inproceedings{92ac2f8d44ca4920bec1d0ee4ece9203,

title = "Numerical simulation of silicon micro flat heat pipes with axial triangle grooves",

abstract = "One-dimensional model is developed and solved numerically to investigate the flow of liquid and vapor in triangle grooves. The effect of liquid and vapor interfacial shear stress is taken into account in this model that can greatly improve the accuracy of the results. The results obtained from this simulation contain behaviors of pressure and flow patterns, the effect of different working conditions and so forth. In addition, maximum heat transport capacity of micro heat pipe is calculated. The model predicted results are successfully compared with the experimental results from the published results in literature. The general nature of the model and the associated parametric study ensure the wide applicability of the model.",

keywords = "Maximum heat transport capacity, Micro groove, Numerical simulation, Silicon micro flat heat pipe",

author = "Wang Chao and Liu Xiaowei and Huo Mingxue and Xu Lei",

year = "2008",

doi = "10.1109/ICSICT.2008.4735055",

language = "英语",

isbn = "9781424421855",

series = "International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT",

pages = "2403--2407",

booktitle = "ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings",

note = "2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008 ; Conference date: 20-10-2008 Through 23-10-2008",

}

Chao, W, Xiaowei, L, Mingxue, H & Lei, X 2008, Numerical simulation of silicon micro flat heat pipes with axial triangle grooves. in ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings., 4735055, International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT, pp. 2403-2407, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008, Beijing, China, 20/10/08. https://doi.org/10.1109/ICSICT.2008.4735055

Numerical simulation of silicon micro flat heat pipes with axial triangle grooves. / Chao, Wang; Xiaowei, Liu; Mingxue, Huo et al.
ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. p. 2403-2407 4735055 (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Numerical simulation of silicon micro flat heat pipes with axial triangle grooves

AU - Chao, Wang

AU - Xiaowei, Liu

AU - Mingxue, Huo

AU - Lei, Xu

PY - 2008

Y1 - 2008

N2 - One-dimensional model is developed and solved numerically to investigate the flow of liquid and vapor in triangle grooves. The effect of liquid and vapor interfacial shear stress is taken into account in this model that can greatly improve the accuracy of the results. The results obtained from this simulation contain behaviors of pressure and flow patterns, the effect of different working conditions and so forth. In addition, maximum heat transport capacity of micro heat pipe is calculated. The model predicted results are successfully compared with the experimental results from the published results in literature. The general nature of the model and the associated parametric study ensure the wide applicability of the model.

AB - One-dimensional model is developed and solved numerically to investigate the flow of liquid and vapor in triangle grooves. The effect of liquid and vapor interfacial shear stress is taken into account in this model that can greatly improve the accuracy of the results. The results obtained from this simulation contain behaviors of pressure and flow patterns, the effect of different working conditions and so forth. In addition, maximum heat transport capacity of micro heat pipe is calculated. The model predicted results are successfully compared with the experimental results from the published results in literature. The general nature of the model and the associated parametric study ensure the wide applicability of the model.

KW - Maximum heat transport capacity

KW - Micro groove

KW - Numerical simulation

KW - Silicon micro flat heat pipe

UR - https://www.scopus.com/pages/publications/60649112011

U2 - 10.1109/ICSICT.2008.4735055

DO - 10.1109/ICSICT.2008.4735055

M3 - 会议稿件

AN - SCOPUS:60649112011

SN - 9781424421855

T3 - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT

SP - 2403

EP - 2407

BT - ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings

T2 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008

Y2 - 20 October 2008 through 23 October 2008

ER -

Chao W, Xiaowei L, Mingxue H, Lei X. Numerical simulation of silicon micro flat heat pipes with axial triangle grooves. In ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings. 2008. p. 2403-2407. 4735055. (International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT). doi: 10.1109/ICSICT.2008.4735055

Numerical simulation of silicon micro flat heat pipes with axial triangle grooves

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