Numerical simulation of residual stress during microlayer composite material processing by EBPVD technique

The preparation of microlayer composite material by the electron beam physical vapor deposition (EBPVD) technique was briefly introduced. Taking the advantage of the large-scale commercial software of finite element analysis, a reasonable physical model was built up during the deposition processing and the distribution of residual stress between substrate and deposition layer or among deposition layers was analyzed. The results show that with the increase of substrate preheating temperature, the interlaminar shear stress increases but the axial residual stress decreases. The probability of curling up after de-bonding tends to enhance as the thickness of deposition film increases.