Skip to main navigation Skip to search Skip to main content

Numerical investigation of shape effect on microdroplet evaporation

  • Shuai Shuai
  • , Li Shan
  • , Zichen Du
  • , Baris Dogruoz
  • , Binjian Ma
  • , Damena Agonafer
  • Washington University St. Louis
  • Cisco Systems

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

As electronic devices continue to shrink in size and increase in functionality, effective thermal management has become a critical bottleneck that hinders continued advancement. Two-phase cooling technologies are of growing interest for electronics cooling due to their high heat removal capacity and small thermal resistance (< 0.3 K-cm2/W) [1]. One typical example of a two-phase cooling method is droplet evaporation, which can provide a high heat transfer coefficient with low superheat. While droplet evaporation has been studied extensively and used in many practical cooling applications (e.g., spray cooling), the relevant work has been confined to spherical droplets with axisymmetric geometries. A rationally designed evaporation platform that yields asymmetric meniscus droplets can potentially achieve larger meniscus curvatures, which give rise to higher vapor concentration gradients along the contact line region and therefore yield higher evaporation rates. In this study, we develop a numerical model to investigate the evaporation behavior of asymmetrical microdroplets suspended on a porous micropillar structure. The equilibrium profiles and mass transport characteristics of droplets with circular, triangular, and square contact shapes are explored using the Volume of Fluid (VOF) method. The evaporative mass transport at the liquid-vapor interface is modeled using a simplified Schrage model [2]. The results show highly non-uniform mass transport characteristics for asymmetrical microdroplets, where a higher local evaporation rate is observed near the locations where the meniscus has high curvature. This phenomenon is attributed to a higher local vapor concentration gradient that drives faster vapor diffusion at more curved regions, similar to a lightning rod exhibiting a strong electric field along a highly curved surface. By using contact line confinement to artificially tune the droplet into a more curved geometry, we find the total evaporation rate from a triangular-based droplet is enhanced by 13% compared to a spherical droplet with the same perimeter and liquid-vapor interfacial area. Such a finding can guide the design and optimization of geometric features to improve evaporation in high performance electronics cooling systems.

Original languageEnglish
Title of host publicationASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791851920
DOIs
StatePublished - 2018
Externally publishedYes
EventASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 - San Francisco, United States
Duration: 27 Aug 201830 Aug 2018

Publication series

NameASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018

Conference

ConferenceASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
Country/TerritoryUnited States
CitySan Francisco
Period27/08/1830/08/18

Fingerprint

Dive into the research topics of 'Numerical investigation of shape effect on microdroplet evaporation'. Together they form a unique fingerprint.

Cite this