Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra

Jian Yang; Tong Zhang; Yue Yin; Wenhong Jiang; Yunzhe Du; Xiaofei Zhu; Bo Jiang; Yudong Huang

doi:10.1002/app.48982

Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra

Jian Yang
, Tong Zhang
, Yue Yin
, Wenhong Jiang
, Yunzhe Du
, Xiaofei Zhu
, Bo Jiang^*
, Yudong Huang

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near-infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and C-C double bond value, with determination coefficient (R²) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and C-C double bond value in the photothermal curing process, it proved that the silicone resin cured under UV-radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin.

Original language	English
Article number	48982
Journal	Journal of Applied Polymer Science
Volume	137
Issue number	34
DOIs	https://doi.org/10.1002/app.48982
State	Published - 10 Sep 2020
Externally published	Yes

Keywords

cross-linking
resins
spectroscopy

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10.1002/app.48982

Cite this

@article{514ac6bfcb554df99ce6d2f85a60bba4,

title = "Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra",

abstract = "Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near-infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and C-C double bond value, with determination coefficient (R2) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and C-C double bond value in the photothermal curing process, it proved that the silicone resin cured under UV-radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin.",

keywords = "cross-linking, resins, spectroscopy",

author = "Jian Yang and Tong Zhang and Yue Yin and Wenhong Jiang and Yunzhe Du and Xiaofei Zhu and Bo Jiang and Yudong Huang",

note = "Publisher Copyright: {\textcopyright} 2020 Wiley Periodicals, Inc.",

year = "2020",

month = sep,

day = "10",

doi = "10.1002/app.48982",

language = "英语",

volume = "137",

journal = "Journal of Applied Polymer Science",

issn = "0021-8995",

publisher = "John Wiley \& Sons Inc.",

number = "34",

}

TY - JOUR

T1 - Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra

AU - Yang, Jian

AU - Zhang, Tong

AU - Yin, Yue

AU - Jiang, Wenhong

AU - Du, Yunzhe

AU - Zhu, Xiaofei

AU - Jiang, Bo

AU - Huang, Yudong

PY - 2020/9/10

Y1 - 2020/9/10

N2 - Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near-infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and C-C double bond value, with determination coefficient (R2) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and C-C double bond value in the photothermal curing process, it proved that the silicone resin cured under UV-radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin.

AB - Reactive group content was a key parameter in polymer curing process. However, the conventional methods to measure the curing were destructive and time consuming. In this article, near-infrared spectra technology had been applied for reactive group analysis of the photothermal curing silicone to achieve rapid nondestructive and quantitative detection. The calibration model was developed about epoxy value and C-C double bond value, with determination coefficient (R2) of 0.9631 and 0.9689. Root mean square error of prediction were 0.0179 and 0.0143 by partial least square regression. The optimized calibration model was used to predict the content of epoxy value and C-C double bond value in the photothermal curing process, it proved that the silicone resin cured under UV-radiation and heat. This novel method provided a promising approach to analysis the curing mechanism and quality parameters of resin.

KW - cross-linking

KW - resins

KW - spectroscopy

UR - https://www.scopus.com/pages/publications/85078586986

U2 - 10.1002/app.48982

DO - 10.1002/app.48982

M3 - 文章

AN - SCOPUS:85078586986

SN - 0021-8995

VL - 137

JO - Journal of Applied Polymer Science

JF - Journal of Applied Polymer Science

IS - 34

M1 - 48982

ER -

Nondestructive rapid and quantitative analysis for the curing process of silicone resin by near-infrared spectra

Abstract

Keywords

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