Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

H. Y. Zhao; J. H. Liu; Z. L. Li; Y. X. Zhao; H. W. Niu; X. G. Song; H. J. Dong

doi:10.1016/j.matlet.2016.10.017

Non-interfacial growth of Cu₃Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

H. Y. Zhao
, J. H. Liu
, Z. L. Li^*
, Y. X. Zhao
, H. W. Niu
, X. G. Song
, H. J. Dong

^*Corresponding author for this work

School of Materials Science and Engineering

Harbin Institute of Technology Weihai
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

71 Scopus citations

Abstract

The non-interfacial growth of Cu₃Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu₃Sn phase always nucleated at Cu₆Sn₅/Cu interfaces and grew at the expense of the Cu₆Sn₅ phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu₃Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu₃Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu₃Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu₃Sn.

Original language	English
Pages (from-to)	283-288
Number of pages	6
Journal	Materials Letters
Volume	186
DOIs	https://doi.org/10.1016/j.matlet.2016.10.017
State	Published - 1 Jan 2017

Keywords

Grain morphology
Interfaces
Intermetallic alloys and compounds
TLP soldering
Ultrasonic waves

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10.1016/j.matlet.2016.10.017

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@article{cc830f04a727451e9c5fc6b8f5df3ec9,

title = "Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process",

abstract = "The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always nucleated at Cu6Sn5/Cu interfaces and grew at the expense of the Cu6Sn5 phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu3Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu3Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu3Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu3Sn.",

keywords = "Grain morphology, Interfaces, Intermetallic alloys and compounds, TLP soldering, Ultrasonic waves",

author = "Zhao, \{H. Y.\} and Liu, \{J. H.\} and Li, \{Z. L.\} and Zhao, \{Y. X.\} and Niu, \{H. W.\} and Song, \{X. G.\} and Dong, \{H. J.\}",

note = "Publisher Copyright: {\textcopyright} 2016",

year = "2017",

month = jan,

day = "1",

doi = "10.1016/j.matlet.2016.10.017",

language = "英语",

volume = "186",

pages = "283--288",

journal = "Materials Letters",

issn = "0167-577X",

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TY - JOUR

T1 - Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

AU - Zhao, H. Y.

AU - Liu, J. H.

AU - Li, Z. L.

AU - Zhao, Y. X.

AU - Niu, H. W.

AU - Song, X. G.

AU - Dong, H. J.

PY - 2017/1/1

Y1 - 2017/1/1

N2 - The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always nucleated at Cu6Sn5/Cu interfaces and grew at the expense of the Cu6Sn5 phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu3Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu3Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu3Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu3Sn.

AB - The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always nucleated at Cu6Sn5/Cu interfaces and grew at the expense of the Cu6Sn5 phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu3Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu3Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu3Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu3Sn.

KW - Grain morphology

KW - Interfaces

KW - Intermetallic alloys and compounds

KW - TLP soldering

KW - Ultrasonic waves

UR - https://www.scopus.com/pages/publications/84991681943

U2 - 10.1016/j.matlet.2016.10.017

DO - 10.1016/j.matlet.2016.10.017

M3 - 文章

AN - SCOPUS:84991681943

SN - 0167-577X

VL - 186

SP - 283

EP - 288

JO - Materials Letters

JF - Materials Letters

ER -

Non-interfacial growth of Cu₃Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

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Keywords

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