TY - GEN
T1 - Non-contact monitoring method for overvoltage based on Pockels effect
AU - Deng, Jun
AU - Qian, Hai
AU - Chu, Jinwei
AU - Lu, Zhiliang
AU - Zhang, Liang
AU - Xie, Zhicheng
AU - Zou, Zhilong
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/22
Y1 - 2018/6/22
N2 - To measure the overvoltage accurately, a non-contact monitoring method based on Pockels effect is proposed. Firstly, the stray capacitance between the energized conductor and the transducer is calculated and connected in series with the dividing capacitor of the transducer in order to constitute a capacitive voltage divider, which can convert the high-amplitude over-voltage signal into a low voltage signal. Secondly, adopt the Pockels electro-optic crystal (Bismuth Germanium Oxide, BGO) with the design of dual-light-channel compensation to measure the low voltage signal, then the value of the high-amplitude overvoltage can be calculated. The feasibility and effectiveness of this method are verified by comparing with the contact measurement.
AB - To measure the overvoltage accurately, a non-contact monitoring method based on Pockels effect is proposed. Firstly, the stray capacitance between the energized conductor and the transducer is calculated and connected in series with the dividing capacitor of the transducer in order to constitute a capacitive voltage divider, which can convert the high-amplitude over-voltage signal into a low voltage signal. Secondly, adopt the Pockels electro-optic crystal (Bismuth Germanium Oxide, BGO) with the design of dual-light-channel compensation to measure the low voltage signal, then the value of the high-amplitude overvoltage can be calculated. The feasibility and effectiveness of this method are verified by comparing with the contact measurement.
KW - Bismuth germanium oxide
KW - Dual-light-channel
KW - Overvoltage
KW - Pockels effect
UR - https://www.scopus.com/pages/publications/85050095773
U2 - 10.1109/ISEMC.2018.8393991
DO - 10.1109/ISEMC.2018.8393991
M3 - 会议稿件
AN - SCOPUS:85050095773
T3 - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
SP - 1261
EP - 1266
BT - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
Y2 - 14 May 2018 through 18 May 2018
ER -