TY - GEN
T1 - Nanoscale analysis of ultrasonic wedge bond interface by using high-resolution transmission electron microscopy
AU - Ji, Hongjun
AU - Li, Mingyu
AU - Wang, Chunqing
AU - Kim, Jongmyung
AU - Kim, Daewon
PY - 2008
Y1 - 2008
N2 - In this paper, the bond interface of Al-1wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate Au 8Al3 phase penetrated among the Al-Au solid solutions. The diffusion distance was not more than 100nm analyzed by energy x-ray dispersive spectrum. This process controlled by solid diffusion reaction was realized by the rapid and periodic ultrasonic vibration according to the theoretical calculation based on the Fick's Law and the observation of the deformation twins among the bond wire and within the interfacial diffusion layer.
AB - In this paper, the bond interface of Al-1wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate Au 8Al3 phase penetrated among the Al-Au solid solutions. The diffusion distance was not more than 100nm analyzed by energy x-ray dispersive spectrum. This process controlled by solid diffusion reaction was realized by the rapid and periodic ultrasonic vibration according to the theoretical calculation based on the Fick's Law and the observation of the deformation twins among the bond wire and within the interfacial diffusion layer.
UR - https://www.scopus.com/pages/publications/52449095884
U2 - 10.1109/ICEPT.2008.4607055
DO - 10.1109/ICEPT.2008.4607055
M3 - 会议稿件
AN - SCOPUS:52449095884
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -