Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

Hongjun Ji; Mingyu Li; Jong Myung Kim; Dae Won Kim; Chunqing Wang

doi:10.1016/j.matchar.2008.01.001

Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

Hongjun Ji
, Mingyu Li^*
, Jong Myung Kim
, Dae Won Kim
, Chunqing Wang

^*Corresponding author for this work

School of Integrated Circuits

University Town of Shenzhen
Jeonnam Provincial College
Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

29 Scopus citations

Abstract

Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au₈Al₃ formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration.

Original language	English
Pages (from-to)	1419-1424
Number of pages	6
Journal	Materials Characterization
Volume	59
Issue number	10
DOIs	https://doi.org/10.1016/j.matchar.2008.01.001
State	Published - Oct 2008

Keywords

Cyclic vibration
Diffusion
Nanostructure
Ultrasonic wedge bonding

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10.1016/j.matchar.2008.01.001

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@article{fdb30da5fba140368eb2718679717a75,

title = "Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy",

abstract = "Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au8Al3 formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration.",

keywords = "Cyclic vibration, Diffusion, Nanostructure, Ultrasonic wedge bonding",

author = "Hongjun Ji and Mingyu Li and Kim, \{Jong Myung\} and Kim, \{Dae Won\} and Chunqing Wang",

year = "2008",

month = oct,

doi = "10.1016/j.matchar.2008.01.001",

language = "英语",

volume = "59",

pages = "1419--1424",

journal = "Materials Characterization",

issn = "1044-5803",

publisher = "Elsevier Inc.",

number = "10",

}

TY - JOUR

T1 - Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

AU - Ji, Hongjun

AU - Li, Mingyu

AU - Kim, Jong Myung

AU - Kim, Dae Won

AU - Wang, Chunqing

PY - 2008/10

Y1 - 2008/10

N2 - Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au8Al3 formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration.

AB - Nano-scale interfacial details of ultrasonic AlSi1 wire wedge bonding to a Au/Ni/Cu pad were investigated using high resolution transmission electron microscopy (HRTEM). The intermetallic phase Au8Al3 formed locally due to diffusion and reaction activated by ultrasound at the Al/Au bond interface. Multilayer sub-interfaces roughly parallel to the wire/pad interface were observed among this phase, and interdiffusional features near the Au pad resembled interference patterns, alternately dark and bright bars. Solid-state diffusion theory cannot be used to explain why such a thick compound formed within milliseconds at room temperature. The major formation of metallurgical bonds was attributed to ultrasonic cyclic vibration.

KW - Cyclic vibration

KW - Diffusion

KW - Nanostructure

KW - Ultrasonic wedge bonding

UR - https://www.scopus.com/pages/publications/50149114962

U2 - 10.1016/j.matchar.2008.01.001

DO - 10.1016/j.matchar.2008.01.001

M3 - 文章

AN - SCOPUS:50149114962

SN - 1044-5803

VL - 59

SP - 1419

EP - 1424

JO - Materials Characterization

JF - Materials Characterization

IS - 10

ER -

Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

Abstract

Keywords

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