Multiangle combined magnetic-field annealing of Co-based amorphous microwires for sensor applications

Jing Shun Liu; Da Yue Zhang; Fu Yang Cao; Da Wei Xing; Dong Ming Chen; Xiang Xue; Jian Fei Sun

doi:10.1002/pssa.201127538

Multiangle combined magnetic-field annealing of Co-based amorphous microwires for sensor applications

Jing Shun Liu^*
, Da Yue Zhang
, Fu Yang Cao
, Da Wei Xing
, Dong Ming Chen
, Xiang Xue
, Jian Fei Sun

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

The effect of multiangle combined magnetic-field annealing (MCMFA) on the GMI performance of melt-extracted Co-based amorphous microwires for sensor applications is studied using a precision impedance analyzer. Experimental results indicated that MCMFA treatment can effectively improve the GMI effect comparing with as-cast and conventional vacuum-annealed (CVA) wires. The maximum GMI ratio [ΔZ/Z _max] _max and field response sensitivity ε _max of transverse combined magnetic-field annealed (TCMFA, α = 90°) wires can be increased at 10 MHz to 310.7 and 30.91%/Oe, respectively, through with circumferential anisotropy field expanded and GMI changed from single peak (SP) to double peaks (DPs). DPs behavior of TCMFA wire is due to the typically "nail-sticked" action of magnetic moment rotation at relatively high frequency (up to ≥1 MHz). It can therefore be concluded that MCMFA could be used to develop Co-based microwires with enhanced GMI effect for high-resolution sensor applications.

Original language	English
Pages (from-to)	984-989
Number of pages	6
Journal	Physica Status Solidi (A) Applications and Materials Science
Volume	209
Issue number	5
DOIs	https://doi.org/10.1002/pssa.201127538
State	Published - May 2012
Externally published	Yes

Keywords

amorphous microwires
giant magnetoimpedance
multiangle combined magnetic-field annealing

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title = "Multiangle combined magnetic-field annealing of Co-based amorphous microwires for sensor applications",

abstract = "The effect of multiangle combined magnetic-field annealing (MCMFA) on the GMI performance of melt-extracted Co-based amorphous microwires for sensor applications is studied using a precision impedance analyzer. Experimental results indicated that MCMFA treatment can effectively improve the GMI effect comparing with as-cast and conventional vacuum-annealed (CVA) wires. The maximum GMI ratio [ΔZ/Z max] max and field response sensitivity ε max of transverse combined magnetic-field annealed (TCMFA, α = 90°) wires can be increased at 10 MHz to 310.7 and 30.91\%/Oe, respectively, through with circumferential anisotropy field expanded and GMI changed from single peak (SP) to double peaks (DPs). DPs behavior of TCMFA wire is due to the typically {"}nail-sticked{"} action of magnetic moment rotation at relatively high frequency (up to ≥1 MHz). It can therefore be concluded that MCMFA could be used to develop Co-based microwires with enhanced GMI effect for high-resolution sensor applications.",

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author = "Liu, \{Jing Shun\} and Zhang, \{Da Yue\} and Cao, \{Fu Yang\} and Xing, \{Da Wei\} and Chen, \{Dong Ming\} and Xiang Xue and Sun, \{Jian Fei\}",

year = "2012",

month = may,

doi = "10.1002/pssa.201127538",

language = "英语",

volume = "209",

pages = "984--989",

journal = "Physica Status Solidi (A) Applications and Materials Science",

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T1 - Multiangle combined magnetic-field annealing of Co-based amorphous microwires for sensor applications

AU - Liu, Jing Shun

AU - Zhang, Da Yue

AU - Cao, Fu Yang

AU - Xing, Da Wei

AU - Chen, Dong Ming

AU - Xue, Xiang

AU - Sun, Jian Fei

PY - 2012/5

Y1 - 2012/5

N2 - The effect of multiangle combined magnetic-field annealing (MCMFA) on the GMI performance of melt-extracted Co-based amorphous microwires for sensor applications is studied using a precision impedance analyzer. Experimental results indicated that MCMFA treatment can effectively improve the GMI effect comparing with as-cast and conventional vacuum-annealed (CVA) wires. The maximum GMI ratio [ΔZ/Z max] max and field response sensitivity ε max of transverse combined magnetic-field annealed (TCMFA, α = 90°) wires can be increased at 10 MHz to 310.7 and 30.91%/Oe, respectively, through with circumferential anisotropy field expanded and GMI changed from single peak (SP) to double peaks (DPs). DPs behavior of TCMFA wire is due to the typically "nail-sticked" action of magnetic moment rotation at relatively high frequency (up to ≥1 MHz). It can therefore be concluded that MCMFA could be used to develop Co-based microwires with enhanced GMI effect for high-resolution sensor applications.

AB - The effect of multiangle combined magnetic-field annealing (MCMFA) on the GMI performance of melt-extracted Co-based amorphous microwires for sensor applications is studied using a precision impedance analyzer. Experimental results indicated that MCMFA treatment can effectively improve the GMI effect comparing with as-cast and conventional vacuum-annealed (CVA) wires. The maximum GMI ratio [ΔZ/Z max] max and field response sensitivity ε max of transverse combined magnetic-field annealed (TCMFA, α = 90°) wires can be increased at 10 MHz to 310.7 and 30.91%/Oe, respectively, through with circumferential anisotropy field expanded and GMI changed from single peak (SP) to double peaks (DPs). DPs behavior of TCMFA wire is due to the typically "nail-sticked" action of magnetic moment rotation at relatively high frequency (up to ≥1 MHz). It can therefore be concluded that MCMFA could be used to develop Co-based microwires with enhanced GMI effect for high-resolution sensor applications.

KW - amorphous microwires

KW - giant magnetoimpedance

KW - multiangle combined magnetic-field annealing

UR - https://www.scopus.com/pages/publications/84860652897

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DO - 10.1002/pssa.201127538

M3 - 文章

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SN - 1862-6300

VL - 209

SP - 984

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JO - Physica Status Solidi (A) Applications and Materials Science

JF - Physica Status Solidi (A) Applications and Materials Science

IS - 5

ER -

Multiangle combined magnetic-field annealing of Co-based amorphous microwires for sensor applications

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Keywords

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