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Multi-port Metasurface Antenna on Fan-out Wafer Level Packaging

  • Harbin Institute of Technology Shenzhen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper proposed a four-port circularly polarized metasurface antenna using L probe feeding structure on fan-out wafer level package(FOWLP) the dimensions of this package are 17.2x17.2x0.3 mm3 the periodic arranged square patch cells are chosen as the radiator. Four feeding ports are set symmetrically in ground plane and fed with a 90 phase difference between two adjacent ports the proposed antenna shows a low profile of 0.028λ0(and λ0is the free-space wavelength at 27.8 GHz) the simulation results show that the maximal peak realized gain is 11.8 dBic at 27.8 GHz and the-10 dB inputs impedance bandwidth is 12.2% from 26.2 GHz to 29.6 GHz, and the axial ratio is lower than 3 dB in this bandwidth achieving a circularly polarized state.

Original languageEnglish
Title of host publicationProceedings of the 2021 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages310-312
Number of pages3
ISBN (Electronic)9781665432436
DOIs
StatePublished - 2021
Externally publishedYes
Event2021 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2021 - Virtual, Online, China
Duration: 11 Oct 202113 Oct 2021

Publication series

NameProceedings of the 2021 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2021

Conference

Conference2021 Cross Strait Radio Science and Wireless Technology Conference, CSRSWTC 2021
Country/TerritoryChina
CityVirtual, Online
Period11/10/2113/10/21

Keywords

  • circular polarization
  • fan-out wafer level packaging (FOWLP)
  • metasurface
  • multi-port antenna

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