Multi-path nanometric cutting of molecular dynamics simulation

Molecular dynamics simulations for multi-path nanomachining process are performed to study the nanomachining mechanism, and to analysis the effect on the surface quality, the subsurface damaged layers, reciprocating cutting force. The results show that the prior cutting process is accompanied with the development of many dislocations. However, in the reciprocating cutting process, atoms are removed mainly by the compre e s s eing, ie xtruding and attracting because the defects from the prior cutting process restrict the movement of dislocations. The cutting force from reciprocating cutting process shows more obvious size effect than that from the prior cutting process. Under the same total cutting depth and the diffe rent feeding depth, the total cutting force increases as the second feeding depth decreases. While the order degree of the subsurface of the nanostructure increases. The surface quality of the nanomachined surface and the shape of the scratched groove is relation closely to the offset distance of the tool. The affected zone from the second feeding cutting process is larger than that from the prior cutting process. The second feeding cutting force increases as the offset distance of the tool increase. It is noted that the second feeding cutting force is not zero but closed to 30 percent of the prior cutting force under the condition of the offset distance of the tool at 0a0. When the offset distance of the tool is 10a0, the reciprocating cutting force is up to 90 percent of the prior cutting force.