@inproceedings{bc193f3874cf43d9bc787ff2d806661d,
title = "Morphology, kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface",
abstract = "We proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder. We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures. Based on this anisotropic growth behavior, a supply-controlled kinetic model of Cu6Sn5 phase was established. In addition, this study could deepen our understanding of the solid-state phase transformation in Cu6Sn5, and also be of great significance in the interfacial reliability of solder interconnections.",
keywords = "CuSn, anisotropic growth, hexagonal-rod shape, kinetics, service reliability",
author = "Zhihao Zhang and Huijun Cao and Yong Xiao and Mingyu Li",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",
year = "2014",
month = oct,
day = "13",
doi = "10.1109/ICEPT.2014.6922827",
language = "英语",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1056--1059",
editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",
booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",
address = "美国",
}