TY - GEN
T1 - Morphology control of copper nanomaterials for IC bonding
AU - Wen, Jiayue
AU - Tian, Yanhong
AU - Jiang, Zhi
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/5/4
Y1 - 2017/5/4
N2 - Copper nanoparticles paste was prepared as inconnection materials of power electronics using potassium borohydride (KBH4) as reduction. Various influences on the morpholorgy of copper nanoparticles were discussed, such as reaction time, concentration of precursor ([Cu(NH3)4]SO4) or reducing agent (KBH4) and surfactant (polyvinyl pyrrolidone, PVP). Meanwhile, those influence to preparing pure copper nanomaterials, the growth process and phase evolution of copper nanomaterials were discussed. Some new conclusions about controlling the morphology of copper nanowires were drawn about reaction time and reaction temperature. This simple and feasible method of preparing nanomaterials are not limited to devices bonging, which have applications in printing electronics, transparent conducting films and even smart electronics.
AB - Copper nanoparticles paste was prepared as inconnection materials of power electronics using potassium borohydride (KBH4) as reduction. Various influences on the morpholorgy of copper nanoparticles were discussed, such as reaction time, concentration of precursor ([Cu(NH3)4]SO4) or reducing agent (KBH4) and surfactant (polyvinyl pyrrolidone, PVP). Meanwhile, those influence to preparing pure copper nanomaterials, the growth process and phase evolution of copper nanomaterials were discussed. Some new conclusions about controlling the morphology of copper nanowires were drawn about reaction time and reaction temperature. This simple and feasible method of preparing nanomaterials are not limited to devices bonging, which have applications in printing electronics, transparent conducting films and even smart electronics.
UR - https://www.scopus.com/pages/publications/85020030868
U2 - 10.1109/CSTIC.2017.7919863
DO - 10.1109/CSTIC.2017.7919863
M3 - 会议稿件
AN - SCOPUS:85020030868
T3 - China Semiconductor Technology International Conference 2017, CSTIC 2017
BT - China Semiconductor Technology International Conference 2017, CSTIC 2017
A2 - Liang, Steve
A2 - Shi, Ying
A2 - Huang, Ru
A2 - Lin, Qinghuang
A2 - Huang, David
A2 - Wu, Hanming
A2 - Wang, Yuchun
A2 - Claeys, Cor
A2 - Lai, Kafai
A2 - Zhang, Ying
A2 - Song, Peilin
A2 - Shi, Viyu
A2 - Guo, Zhen
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 China Semiconductor Technology International Conference, CSTIC 2017
Y2 - 12 March 2017 through 13 March 2017
ER -