@inproceedings{1b13818933c44c0ab1e80c1048ab5e43,
title = "Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints",
abstract = "Electron Backscatter Diffraction (EBSD) technology combined with Scanning Electron Microscope (SEM) was employed to investigate morphologies and orientations of Cu-Sn intermetallic compounds formed between Sn3.5Ag0.5Cu lead-free solder alloy and copper substrate. After long-time soldering, two small planes with a break angle appear on top and side of Cu 6Sn 5 scallop, and the angle between the adjacent planes was approximately 120°. Round plate-type defects were found on the top side of Cu substrate. Preferable IMCs grain orientation was Cu 6Sn 5 (0001) //substrate surface, Cu 3Sn ({\=1}00) \& (100) //substrate surface. Single crystal Cu-Sn IMCs preferable grain orientation was Cu 3Sn (100)// Cu 6Sn 5 (0001).",
keywords = "Cu-Sn IMCs, Grain orientation, Morphology",
author = "Yanhong Tian and Wei Liu and Chunjin Hang and Xuelin Wang and Ruiyang Liu and Chunqing Wang",
year = "2012",
language = "英语",
isbn = "9781615039753",
series = "IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference",
pages = "217--220",
booktitle = "IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference",
note = "5th International Brazing and Soldering Conference, IBSC 2012 ; Conference date: 22-04-2012 Through 25-04-2012",
}