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Molecular dynamics study of nano-tribological properties of silicon nitride films

  • Longqiu Li*
  • , Shufeng Wang
  • , Andrey Ovcharenko
  • , Wuyi Wang
  • *Corresponding author for this work
  • Harbin Institute of Technology
  • Western Digital

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Silicon nitride films were attracting extensive research interest in the past few decades as hard disk protective coating, especially the beta-silicon nitride (β-Si3N4) films and amorphous silicon nitride (SiNx) films, which have high hardness, chemical durability and low friction coefficient properties against wear, corrosion and reducing the friction resistance, respectively. Considerable efforts have been made in studying silicon nitride. However, it's difficult to determine its nano-tribological properties experimentally since the results were affected by a lot of contact and environment conditions. The molecular dynamics (MD) simulation method is employed in this work. A rigid diamond sphere modeled as a spherical tip are sliding over a layered silicon nitride film substrate, respectively, to investigate the tribological properties of silicon nitride films. The effect of the relative sliding velocity and sliding direction, the normal force and the thickness of crystalline silicon nitride films on the friction coefficient of silicon nitride films were investigated.

Original languageEnglish
Title of host publication19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- andNanosystems
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791846353
DOIs
StatePublished - 2014
EventASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2014 - Buffalo, United States
Duration: 17 Aug 201420 Aug 2014

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume4

Conference

ConferenceASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE 2014
Country/TerritoryUnited States
CityBuffalo
Period17/08/1420/08/14

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