Abstract
In order to study the tension mechanisms of fcc metals, molecular dynamics simulation was carried out on the tension process of single crystal copper, and the effects of different temperatures and strain rates on the tensile behavior were also studied. The results show that the yield stress decreases obviously with the increase of temperature. The strain rate has no effect on the elastic behavior and yield mechanism, but has effect on the plastic behavior. With the increase of strain rate, the tension yield stress increases accordingly.
| Original language | English |
|---|---|
| Pages (from-to) | 1677-1680 |
| Number of pages | 4 |
| Journal | Harbin Gongye Daxue Xuebao/Journal of Harbin Institute of Technology |
| Volume | 38 |
| Issue number | 10 |
| State | Published - Oct 2006 |
| Externally published | Yes |
Keywords
- Molecular dynamics simulation
- Single crystal copper
- Tension
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